Lihang Yu

Embedded cooling method with configurability and replaceability for multi-chip electronic devices

Nan Zhang, Binbin Jiao, Yuxin Ye et al. · Energy Conversion and Management · 2021 · 122 citations

Electrical Engineering, Engineering, Advanced Packaging (Semiconductors) +14

A combined solution of thermoelectric coolers and microchannels for multi-chip heat dissipation with precise temperature uniformity control

Bo Cong, Yanmei Kong, Yuxin Ye et al. · Applied Thermal Engineering · 2022 · 47 citations

Electrical Engineering, Engineering, Liquid Metal Cooling +13

Low Stress TSV Arrays for High-Density Interconnection

Binbin Jiao, Jingping Qiao, Shiqi Jia et al. · Engineering · 2024 · 32 citations · Full text

Materials Science, Advanced Packaging, Electrical Engineering +13

An adaptive thermal management method via bionic sweat pores on electronic devices

Lihang Yu, Binbin Jiao, Yuxin Ye et al. · Applied Thermal Engineering · 2024 · 31 citations

Electronic Devices, Engineering, Thermal Protection +13

Catalytic oxidation of vinyl chloride over Co–Ce composite oxides derived from ZIF-67 template: Effect of cerium incorporation

Hongliang Zhang, Shuoming Wang, Mingju Wang et al. · Journal of Rare Earths · 2022 · 27 citations

Materials Science, Inorganic Chemistry, Chemical Engineering +9