Concepedia

Chengshuo Jiang

CJ

1

Publications

54

Citations

1

H-Index

2018

Active since

Affiliations

Beijing University of Technology(Current)

Chengshuo Jiang is an author at Beijing University of Technology specializing in applied physics, electronic packaging, and mechanical engineering.

Top concepts

EngineeringMicrostructureApplied PhysicsMaterial ScienceMicroelectronicsMicrofabricationThermal PropertiesElectronic PackagingMaterials EngineeringElectrical Engineering

Publications per year

2018–2018

1

Publications

1

Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages

Chengshuo Jiang, Jiajie Fan, Cheng Qian et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 54 citations

Engineering, Mechanical Engineering, Advanced Packaging (Semiconductors) +16

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