J. A. Augis - Concepedia

Author

J. A. Augis

Ross Laboratories (United States)

Also Known As

J A Augis, J. A. AUGIS, J. A. Augis, J. Augis, J.A. Augis, JACQUES A. AUGIS, Jacques A. Augis

Publications

1.7K

Citations

H-Index

Concepts

All Affiliations

Ross Laboratories (United States)AT&T (United States)

About

J. A. Augis is an author at Ross Laboratories (United States) specializing in engineering, materials science, and surface science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	12	14	403
2	Applied Physics	6	6	130
3	Chemistry	3	3	132
4	Chemical Engineering	2	2	105
5	Civil Engineering	1	1	11

J. A. Augis

Publications

1.6K

Citations

H-Index

Page 1

	Year	Citations
Calculation of the Avrami parameters for heterogeneous solid state reactions using a modification of the Kissinger method J. A. Augis, James Bennett Journal of thermal analysis	1978	1.2K
The oxidation of cobalt in air from room temperature to 467�C Harland G. Tompkins, J. A. Augis Oxidation of Metals Materials ScienceRoom TemperatureChemical EngineeringEngineeringOxidation Resistance	1981	84
Hardening mechanisms of hard gold Chi-Fung Lo, J. A. Augis, M. R. Pinnel Journal of Applied Physics Materials ScienceMaterials EngineeringEngineeringSevere Plastic DeformationApplied Physics	1979	53
A comprehensive surface mount reliability model covering several generations of packaging and assembly technology Jean‐Paul Clech, John Manock, D.M. Noctor, IEEE Transactions on Components Hybrids and Manufacturing Technology EngineeringExtensive SetMechanical EngineeringCsmr MethodologyAccurate Surface Mount	1993	39
Kinetics of the Transformation of Metastable Tin‐Nickel Deposits: I . Determination of the Avrami Equation Parameters by DSC or DTA J. A. Augis, James Bennett Journal of The Electrochemical Society Materials ScienceHigh Temperature MaterialsEngineeringDifferential Scanning CalorimetryDifferential Thermal Analysis	1978	38
Local CTE mismatch in SM leaded packages: a potential reliability concern Jean‐Paul Clech, F.M. Langerman, J. A. Augis Advanced PackagingMaterials ScienceEngineeringFatigue DamageLow-cycle Fatigue	2002	31
Plasma and electrode interactions in short gap discharges in air II. Electrode effects† J. A. Augis, FRANK J. GIBSON, Eoin W. Gray International Journal of Electronics Electrical EngineeringElectrode Surface DamageEngineeringGlow DischargePlasma Theory	1971	30
Reliability figures of merit for surface-soldered leadless chip carriers compared to lead packages Jean‐Paul Clech, W. Engelmaier, R.W. Kotlowitz, IEEE Transactions on Components Hybrids and Manufacturing Technology EngineeringAttachment Reliability TargetReliability EngineeringAdvanced Packaging (Semiconductors)Electronic Packaging	1989	24
The hardness and ductility of sputtered gold films J. A. Augis, Chi-Fung Lo, M. R. Pinnel Thin Solid Films Materials ScienceMaterials EngineeringEngineeringSurface ScienceSputtered Gold Films	1979	22
Cathodic contact erosion due to short-duration gas breakdown arcs Eoin W. Gray, Julian R. Pharney, J. A. Augis Journal of Physics D Applied Physics EngineeringGlow DischargeFluid MechanicsSurface ProcessingPalladium Contacts	1972	21

Page 1