Statistics
Publications
3
Citations
39
H-Index
3
Active since
2016
Affiliations
H. P. Pu is an author at Taiwan Semiconductor Manufacturing Company (Taiwan) specializing in electrical engineering, chip packaging, and engineering.
Publications per year
2016–2024
3
3
Applications and Reliability Study of InFO_UHD (Ultra-High-Density) Technology
T. Ko, H. P. Pu, H. J. Kuo et al. · 2020 · 17 citations
Engineering, Electrical Engineering, High-performance Computing +17
Cu Bump Flip Chip Package Reliability on 28nm Technology
Pei-Haw Tsao, Steven Hsu, Yen‐Lien Kuo et al. · 2016 · 11 citations
Engineering, Electrical Engineering, Materials Engineering +16
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