Pei-Haw Tsao

Manufacturing stresses in the die due to the die-attach process

Pei-Haw Tsao, Arkady Voloshin · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1995 · 28 citations

Materials Science, Engineering, Die-attach Assembly +14

In Situ Evaluation of Residual Stresses in an Organic Die-Attach Adhesive

Arkady Voloshin, Pei-Haw Tsao, Raymond A. Pearson · Journal of Electronic Packaging · 1998 · 24 citations

Materials Science, Advanced Packaging, Engineering +13

Underfill characterization for low-k dielectric / Cu interconnect IC flip-chip package reliability

Pei-Haw Tsao, Chender Huang, Mirng-Ji Lii et al. · 2004 · 16 citations

Materials Engineering, Electrical Engineering, Chip-scale Package +15

Board Level Reliability Enhancement of WLCSP with Large Chip Size

Pei-Haw Tsao, Tung-Bao Lu, T. M. Chen et al. · 2018 · 12 citations

Advanced Packaging, Electrical Engineering, Reliability Engineering +13

Cu Bump Flip Chip Package Reliability on 28nm Technology

Pei-Haw Tsao, Steven Hsu, Yen‐Lien Kuo et al. · 2016 · 11 citations

Reliability, Materials Engineering, Electrical Engineering +15