Concepedia

Pardeep K. Bhatti

PK

Statistics

Publications

4

Citations

136

H-Index

4

Active since

1995

Affiliations

Georgia Institute of Technology(Current)

Intel (United States)

Georgia Tech Research Institute

Pardeep K. Bhatti is an author at Georgia Institute of Technology specializing in electronic packaging, engineering, and mechanical engineering.

Top concepts

EngineeringElectronic PackagingMechanical EngineeringSolid MechanicsElectrical EngineeringReliability EngineeringMaterial ScienceMicroelectronicsThermal EngineeringComputer Engineering

Publications per year

1995–2006

4

Publications

4

Effect of Finite Element Modeling Techniques on Solder Joint Fatigue Life Prediction of Flip-Chip BGA Packages

Xuejun Fan, Min Pei, Pardeep K. Bhatti · 2006 · 79 citations

Engineering, Industrial Engineering, Life Prediction +19

Reliability Analysis of SnPb and SnAgCu Solder Joints in FC-BGA Packages with Thermal Enabling Preload

Pardeep K. Bhatti, Min Pei, Xuejun Fan · 2006 · 22 citations

Engineering, Mechanical Engineering, Reliability Engineering +21

Field Condition Reliability Assessment for SnPb and SnAgCu Solder Joints in Power Cycling Including Mini Cycles

Min Pei, Xuejun Fan, Pardeep K. Bhatti · 2006 · 18 citations

Engineering, Mechanical Engineering, System Reliability +16

Three-Dimensional Creep Analysis of Solder Joints in Surface Mount Devices

Pardeep K. Bhatti, Klaus Gschwend, Abel Y. Kwang et al. · Journal of Electronic Packaging · 1995 · 17 citations

Friction Welding, Engineering, Mechanical Engineering +19

1–4 of 4