Concepedia

S. Komiya

SK

35

Publications

996

Citations

19

H-Index

1969

Active since

Affiliations

Ulvac (Japan)(Current)

The University of Osaka

Tokai University

S. Komiya is an author at Ulvac (Japan) specializing in engineering, applied physics, and materials science.

Top concepts

EngineeringApplied PhysicsMaterial ScienceSurface ScienceElectrical EngineeringThin FilmsChemistryPhysicsMaterials EngineeringCorrosion

Publications per year

1969–1987

35

Publications

35

Applications of wear-resistant thick films formed by physical vapor deposition processes

Kazuo Nakamura, Konosuke INAGAWA, Kazuyuki Tsuruoka et al. · Thin Solid Films · 1977 · 96 citations

Materials Science, Engineering, Wear Prevention +8

Diffuse interface in Si (substrate)-Au (evaporated film) system

Tadashi Narusawa, S. Komiya, Akio Hiraki · Applied Physics Letters · 1973 · 68 citations · Full text

Materials Science, Surface Characterization, Interface Chemistry +15

Characterization of thick chromium-carbon and chromium-nitrogen films deposited by hollow cathode discharge

S. Komiya, Shuji Ono, N. Umezu et al. · Thin Solid Films · 1977 · 58 citations

Materials Science, Electrical Engineering, Engineering +9

Metallic state of Si in Si−noble−metal vapor−quenched alloys studied by Auger electron spectroscopy

Akio Hiraki, Akira Shimizu, Motohiro Iwami et al. · Applied Physics Letters · 1975 · 57 citations

Materials Science, Materials Engineering, Ii-vi Semiconductor +13

Physical vapor deposition of thick Cr and its carbide and nitride films by hollow‐cathode discharge

S. Komiya, Kazuyuki Tsuruoka · Journal of Vacuum Science and Technology · 1976 · 57 citations

Engineering, Physical Vapor Deposition, Dry Process +20

Rows per page

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