Concepedia

Author

Paul Paret

National Renewable Energy LaboratoryORCID

Also Known As

P. P. Paret, P. Paret, Paret, Paul, Paret, Paul P [National Renewable Energy Laboratory (NREL), Golden, CO (United States)], Paret, Paul P [National Renewable Energy Laboratory (NREL), Golden, CO (United States)]; DeVoto, Douglas J [National Renewable Energy Laboratory (NREL), Golden, CO (United States)]; Narumanchi, Sreekant V [National Renewable Energy Laboratory (NREL), Golden, CO (United States)], Paret, Paul P [National Renewable Energy Laboratory (NREL), Golden, CO (United States)]; Major, Joshua [National Renewable Energy Laboratory (NREL), Golden, CO (United States)]; DeVoto, Douglas J [National Renewable Energy Laboratory (NREL), Golden, CO (United States)]; Narumanchi, Sreekant V [National Renewable Energy Laboratory (NREL), Golden, CO (United States)]; Tan, Yansong [Virginia Tech]; Lu, Guo-Quan [Virginia Tech], Paret, Paul; Major, Joshua; DeVoto, Douglas; Narumanchi, Sreekant, Paul P. Paret, Paul Paret

45

Publications

330

Citations

13

H-Index

44

Concepts

All Affiliations

National Renewable Energy LaboratoryGeorgia Institute of TechnologyVirginia TechDuPont (United States)DEVCOM Army Research Laboratory
PP

About

Paul Paret is an author at National Renewable Energy Laboratory specializing in engineering, thermal engineering, and electronic packaging.

Top Concepts

#ConceptH-IndexPublicationsCitations

1

Engineering

11

11

201

2

Electrical Engineering

9

9

163

3

Materials Science

8

8

154

4

Materials Engineering

4

4

85

5

Applied Physics

3

3

53

Paul Paret

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15

Publications

271

Citations

13

H-Index

YearCitations

PCB-on-DBC GaN Power Module Design With High-Density Integration and Double-Sided Cooling

Xingyue Tian, Niu Jia, Douglas DeVoto,

IEEE Transactions on Power Electronics

2023

26

Reliability of Emerging Bonded Interface Materials for Large-Area Attachments

Paul Paret, Douglas DeVoto, Sreekant Narumanchi

IEEE Transactions on Components Packaging and Manufacturing Technology

2015

24

Transient Liquid Phase Bonding of AlN to AlSiC for Durable Power Electronic Packages

Darshan G. Pahinkar, Waylon Puckett, Samuel Graham,

Advanced Engineering Materials

2018

24

Degradation characterization of thermal interface greases

Douglas DeVoto, Joshua Major, Paul Paret,

2017

23

Ultracompliant Heterogeneous Copper–Tin Nanowire Arrays Making a Supersolder

Wei Gong, Pengfei Li, Yunheng Zhang,

Nano Letters

2018

23

Reliability and Lifetime Prediction Model of Sintered Silver Under High-Temperature Cycling

Paul Paret, Joshua Major, Douglas DeVoto,

IEEE Journal of Emerging and Selected Topics in Power Electronics

2021

22

Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities

Paul Paret, Donal P. Finegan, Sreekant Narumanchi

Journal of Electronic Packaging

2022

18

Thermal performance and reliability characterization of bonded interface materials (BIMs)

Douglas DeVoto, Paul Paret, Mark Mihalic,

2014

16

Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages

Darshan G. Pahinkar, Lauren Boteler, Dimeji Ibitayo,

Journal of Electronic Packaging

2019

16

Packaging of an 8-kV Silicon Carbide Diode Module with Double-Side Cooling and Sintered-Silver Joints

Zichen Zhang, Jiaxiang Zhang, Jiayu Xu,

2021

16

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