Oluwatosin J. Ojo-Kupoluyi

Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies

T.T. Dele‐Afolabi, M.N.M. Ansari, Azmah Hanim Mohamed Ariff et al. · Journal of Materials Research and Technology · 2023 · 86 citations · Full text

Engineering, Mechanical Engineering, Interlayer Materials +22

Impact of different isothermal aging conditions on the IMC layer growth and shear strength of MWCNT-reinforced Sn–5Sb solder composites on Cu substrate

T.T. Dele‐Afolabi, Azmah Hanim Mohamed Ariff, Oluwatosin J. Ojo-Kupoluyi · Journal of Alloys and Compounds · 2019 · 48 citations

Materials Science, Cu Substrate, Engineering +5

Tailored pore structures and mechanical properties of porous alumina ceramics prepared with corn cob pore‐forming agent

T.T. Dele‐Afolabi, Azmah Hanim Mohamed Ariff, Oluwatosin J. Ojo-Kupoluyi et al. · International Journal of Applied Ceramic Technology · 2020 · 22 citations

Engineering, Mechanical Engineering, Ceramic Powders +16

Interfacial IMC evolution and shear strength of MWCNTs-reinforced Sn–5Sb composite solder joints: Experimental characterization and artificial neural network modelling

T.T. Dele‐Afolabi, Azmah Hanim Mohamed Ariff, Oluwatosin J. Ojo-Kupoluyi et al. · Journal of Materials Research and Technology · 2021 · 11 citations · Full text

Materials Science, Engineering, Material Processing +12