Stress-induced formation mechanism of stacking fault tetrahedra in nano-cutting of single crystal copper - Concepedia

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Stress-induced formation mechanism of stacking fault tetrahedra in nano-cutting of single crystal copper

61

Citations

33

References

2015

Year

Quanlong Wang, Qingshun Bai, Jiaxuan Chen, Yongbo Guo, Wenkun Xie

Applied Surface Science

Materials ScienceEngineeringNanomanufacturingApplied PhysicsFault TetrahedraStress-induced Formation MechanismSingle Crystal CopperMicrostructureMetal Processing

References

	Year	Citations

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