Significant enhancement of the overall performance of SAC joints by adding Cu@Sn@Ag core shell particles and ultrasonically assisted soldering

Effects of Ni modified MWCNTs on the microstructural evolution and shear strength of Sn-3.0Ag-0.5Cu composite solder joints

Haozhong Wang, Xiaowu Hu, Xiongxin Jiang · Materials Characterization · 2020 · 233 citations

Natural Sciences, Materials Engineering, Materials Science +16

Preparation and characterization of Sn-3.0Ag-0.5Cu nano-solder paste and assessment of the reliability of joints fabricated by microwave hybrid heating

Shuai Zhang, Shuai Zhang, Shuye Zhang et al. · Materials Characterization · 2023 · 111 citations

Natural Sciences, Materials Engineering, Materials Science +11

Influence of temperature gradient bonding on the micromorphology and shear performance of Sn-based solder joints: Experiments and first principles calculations

Zezong Zhang, Wenjing Chen, Xiaowu Hu et al. · Journal of Manufacturing Processes · 2024 · 98 citations

Engineering, Materials Engineering, Materials Science +14

Ultra-low temperature sintering of Cu@Ag core-shell nanoparticle paste by ultrasonic in air for high-temperature power device packaging

Hongjun Ji, Junbo Zhou, Meng Liang et al. · Ultrasonics Sonochemistry · 2017 · 96 citations

Natural Sciences, Materials Engineering, Materials Science +12

Interfacial reaction and shear strength of ultrasonically-assisted Sn-Ag-Cu solder joint using composite flux

Haozhong Wang, Xiaowu Hu, Xiongxin Jiang et al. · Journal of Manufacturing Processes · 2020 · 70 citations

Natural Sciences, Materials Engineering, Materials Science +17