Publication | Closed Access
Topologically optimized manifold microchannel heat sink with extreme cooling performance for high heat flux cooling of electronics
46
Citations
63
References
2024
Year
EngineeringLiquid Metal CoolingMicrofabricationHeat ExchangerHeat Transfer EnhancementThermal ManagementComputer EngineeringHigh HeatHeat TransferHeat PipeMicrofluidicsThermal EngineeringMicroelectronics
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