Publication | Closed Access
Radio frequency-assisted curing of on-chip printed CNT/silicone heatsinks produced by material extrusion 3D printing
15
Citations
34
References
2023
Year
Materials Science3D Ic ArchitectureEngineeringAdvanced Packaging (Semiconductors)MicrofabricationRadio Frequency-assisted CuringMaterial Extrusion 3DMechanical EngineeringFabrication TechniquePrinted ElectronicsChip AttachmentHeat TransferElectronic PackagingThermal Engineering3D Printing
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|---|---|---|
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