Effect of boundary conditions on fatigue life of board-level BGA solder joints under random vibration

Vibration analysis for electronic equipment

W. Redman-White · Journal of Sound and Vibration · 1990 · 427 citations

Engineering, Electrical Engineering, Physics +14

High-cycle fatigue life prediction for Pb-free BGA under random vibration loading

Da Yu, Abdullah Al-Yafawi, Tung Nguyen et al. · Microelectronics Reliability · 2010 · 150 citations

Engineering, Materials Engineering, Materials Science +16

Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions

Joshua Adeniyi Depiver, Sabuj Mallik, Emeka H. Amalu · Engineering Failure Analysis · 2021 · 120 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Prognostics implementation of electronics under vibration loading

Jie Gu, Donald E. Barker, Michael Pecht · Microelectronics Reliability · 2007 · 113 citations

Engineering, Electrical Engineering, Systems Engineering +14

Combining vibration test with finite element analysis for the fatigue life estimation of PBGA components

Y.S. Chen, C.S. Wang, Youshe Yang · Microelectronics Reliability · 2008 · 110 citations

Engineering, Materials Engineering, Materials Science +17