Journal of Colloid and Interface Science · 2023 · 37 citations · 52 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsHeat TransferPower ElectronicsConductive MaterialsHeat ConductionSemiconductor Device MaterialsSemiconductor PhysicsThermal Properties Of MaterialsThermal Protection MaterialsElectromagnetic Wave ScatteringElectronic Thermal ConductivityElectronics Thermal PackagingHigh-temperature Device OperationPackaging For Power DevicesPhonon Thermal ConductivityThermal Conductivity
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