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In-situ isothermal aging TEM analysis of a micro Cu/ENIG/Sn solder joint for flexible interconnects

Materials ScienceEngineeringAdvanced Packaging (Semiconductors)Flexible ElectronicsMicrofabricationTem AnalysisApplied PhysicsThermomechanical AnalysisChip AttachmentElectronic PackagingFlexible InterconnectsMicroelectronicsThermal EngineeringMicrostructure