Publication | Closed Access
The microstructure evolution and failure mechanism of Sn37Pb solder joints under the coupling effects of extreme temperature variation and electromigration
12
Citations
32
References
2023
Year
Materials EngineeringMaterials ScienceElectrical EngineeringSn37pb Solder JointsEngineeringAdvanced Packaging (Semiconductors)Extreme Temperature VariationChip AttachmentFailure MechanismElectronic PackagingMicroelectronicsMicrostructure
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