Concepedia

The microstructure evolution and failure mechanism of Sn37Pb solder joints under the coupling effects of extreme temperature variation and electromigration

Shengli Li, Chunjin Hang, Qilong Guan, Xiaojiu Tang, Dan Yu, Ying Ding, Xiuli Wang

Materials Today Communications · 2023 · 14 citations · 32 references

DOI

Concepts

References

32

Kinetics of interfacial reaction in bimetallic CuSn thin films

K. N. Tu, R. D. Thompson · Acta Metallurgica · 1982 · 468 citations

, , +14

Current-crowding-induced electromigration failure in flip chip solder joints

Everett C. C. Yeh, Woon‐Seop Choi, K. N. Tu et al. · Applied Physics Letters · 2002 · 363 citations

, , +17

Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction

Robert Darveaux · Journal of Electronic Packaging · 2002 · 285 citations

, , +17

Failure mechanisms of solder interconnects under current stressing in advanced electronic packages

Y.C. Chan, Daoguo Yang · Progress in Materials Science · 2010 · 275 citations

, , +17

Electromigration in Sn–Pb solder strips as a function of alloy composition

C. Y. Liu, Chih Chen, K. N. Tu · Journal of Applied Physics · 2000 · 153 citations

, , +13