Smart Implant with Bacteria Monitoring and Killing Ability for Orthopedic Applications

Abstract

Bacterial infections around implants constitute a significant cause of implant failures. Early recognition of bacterial adhesion is an essential factor in preventing implant infections. Therefore, an implant capable of detecting and disinfecting initial bacterial adhesion is required. This study reports on the development of an intelligent solution for this issue. We developed an implant integrated with a biosensor electrode based on alternating current (AC) impedance technology to monitor the early growth process of <i>Escherichia coli</i> (<i>E. coli</i>) and its elimination. The biosensor electrode was fabricated by coating polypyrrole (PPy) doped with sodium <i>p</i>-toluenesulfonate (TSONa) on titanium (Ti) surfaces. Monitoring the change in resistance using electrochemical impedance spectroscopy (EIS), combined with an equivalent circuit model (ECM), enables the monitoring of the early adhesion of <i>E. coli</i>. The correlation with the classical optical density (OD) monitoring value reached 0.989. Subsequently, the eradication of bacteria on the electrode surface was achieved by applying different voltages to <i>E. coli</i> cultured on the electrode surface, which caused damage to <i>E. coli</i>. Furthermore, <i>in vitro</i> cellular experiments showed that the PPy coating has good biocompatibility and can promote bone differentiation.