2022 International Electron Devices Meeting (IEDM) · 2022 · 41 citations · 4 references
EngineeringElectrical EngineeringMaterials ScienceElectronic MaterialsMicroelectronicsSemiconductor DevicesFerroelectric MaterialsTopology OptimizationDevice OptimizationEnduranceEndurance OptimizationFerroelectric StructureGate Stack EngineeringInterlayer BondingInterlayer ConnectivityInterlayer Coupling
In face of the critical endurance issue, for the first time we take a holistic perspective to co-optimize the ferroelectric materials and interlayer in FeFET. Compared to the common HZO based gate stack, the novel combination of Hf <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.95</inf> Al <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.05</inf> O <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf> +Al <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf> O <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</inf> enhances the endurance to $\gt 5 \times 10 ^{9}$ cycles while maintaining a retention > 10 years. In-depth analysis based on DFT and DQSCV reveal the reduction of interlayer electric field and interface charge trapping as the mechanism of optimization. We also develop a distributed interface trap model to correlate different trapping dynamics with the interlayer property in each device. This work pushes forward the understanding and development of high endurance strategy for FeFET.
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K.-T. Chen, Hsin-Chin Chen, C.-Y. Liao et al. · IEEE Electron Device Letters · 2019 · 118 citations
Natural Sciences, Electrical Engineering, Materials Science +13
Korok Chatterjee, Sangwan Kim, Golnaz Karbasian et al. · IEEE Electron Device Letters · 2019 · 35 citations