Embedded microfluidic cooling with compact double H type manifold microchannels for large-area high-power chips

High-performance heat sinking for VLSI

David B. Tuckerman, R. F. W. Pease · IEEE Electron Device Letters · 1981 · 5.2K citations

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Design challenges of technology scaling

Shekhar Borkar · IEEE Micro · 1999 · 1.2K citations

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Co-designing electronics with microfluidics for more sustainable cooling

Remco van Erp, Reza Soleimanzadeh, Luca Nela et al. · Nature · 2020 · 1.1K citations · Full text

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The future of microprocessors

Shekhar Borkar, Andrew A. Chien · Communications of the ACM · 2011 · 958 citations

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Wafer bonding for silicon-on-insulator technologies

J. B. Lasky · Applied Physics Letters · 1986 · 574 citations

Engineering, Electrical Engineering, Materials Science +17