Publication | Closed Access

Embedded microfluidic cooling with compact double H type manifold microchannels for large-area high-power chips

EngineeringLiquid Metal CoolingMicrofabricationHeat ExchangerThermal ManagementMicroscale SystemHeat TransferMicroelectronicsThermal EngineeringLarge-area High-power ChipsMicrofluidicsRefrigeration