High temperature oxidation resistance of physical vapor deposited Hf-Si-B2±z thin films

Abstract

Within physical vapor deposited Hf-Si-B2±z thin films, selective diffusion-driven oxidation of Si is identified to cause outstanding oxidation resistance at temperatures up to 1500 °C. After 60 h at 1200 °C, the initially 2.47 µm thin Hf0.20Si0.23B0.57 thin film exhibits a dense oxide scale of only 1.56 µm. The thermally induced decomposition of metastable Hf-Si-B2±z leads not only to the formation of Si precipitates within the remaining thin film (related to a non-homogenous Si distribution after the deposition) but also to pure Si layers on top and bottom of the Hf-Si-B2±z coatings next to the excellent adherend SiO2 based scales.