Highly Stackable 3D Ferroelectric NAND Devices: Beyond the Charge Trap Based Memory

Sunghyun Yoon, Sung-In Hong, Ga-Ram Choi, Daehyun Kim, Ildo Kim, Chang-Han Kim, Kyunghoon Min

2022 · 27 citations · 8 references

Concepts

Abstract

In this study, we demonstrate for the first time the multi-level capable 3D ferroelectricNAND (Fe-NAND) device using the 3D NAND test vehicle for mass production. The present 3D ferroelectric NAND shows the potential multi-level cell operation with the 3.4 V program/erase window. We also reported cycling and retention characteristics.

References

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