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Subcooled flow boiling heat transfer and associated bubble characteristics of FC-72 on a heated micro-pin-finned silicon chip

Heat Transfer ProcessEngineeringBubble DynamicLiquid Metal CoolingMicrofabricationHeat Transfer EnhancementBubble CharacteristicsMicro-pin-finned Silicon ChipElectronic PackagingMultiphase FlowHeat TransferThermal EngineeringBoilingMicroelectronics