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Smart ceramics
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1990
Year
Materials ScienceElectrical EngineeringEngineeringFlexible ElectronicsMicrofabricationMultilayer PackagesCeramic MaterialFunctional CeramicNew GenerationElectronic PackagingCeramic TechnologyElectrical PropertiesSmart Ceramics
Abstract Recent progress in the integration and miniaturization of electroceramic conponents has led to the development of multipurpose electronic packages containing complex three-dimensional circuitry. At the same time, a wide variety of sensors, transducers, and actuators have been fabricated for automotive, military, and consumer electronics applications. By bringing together the ceramic sensors and ceramic actuators in multilayer packages, a new generation of smart ceramics can be developed.