A systematic study of the microwave and thermal cure kinetics of the DGEBA/DDS and DGEBA/DDM epoxy‐amine resin systems

Abstract

Abstract The microwave and thermal cure processes for the epoxy‐amine systems (epoxy resin diglycidyl ether of bisphenol A, DGEBA) with 4,4′‐diaminodiphenyl sulphone (DDS) and 4,4′‐diaminodiphenyl methane (DDM) have been investigated for 1 : 1 stoichiometries by using fiber‐optic FT‐NIR spectroscopy. The DGEBA used was in the form of Ciba‐Geigy GY260 resin. The DDM system was studied at a single cure temperature of 373 K and a single stoichiometry of 20.94 wt% and the DDS system was studied at a stoichiometry of 24.9 wt% and a range of temperatures between 393 and 443 K. The best values of the kinetic rate parameters for the consumption of amines have been determined by a least squares curve fit to a model for epoxy/amine cure. The activation energies for the polymerization of the DGEBA/DDS system were determined for both cure processes and found to be 66 and 69 kJ mol −1 for the microwave and thermal cure processes, respectively. No evidence was found for any specific effect of the microwave radiation on the rate parameters, and the systems were both found to be characterized by a negative substitution effect. Copyright © 2002 John Wiley & Sons, Ltd.