Micro-removal characteristics of SiCp/Al by ultrasonic vibration-assisted scratch

Abstract

SiCp/Al composites have a wide application market in aerospace and electronic packaging fields. However, there are still many problems in micro-removal processing. For enhancing the processing quality and the material removal rate (MRR) during micro-removal, an ultrasonic vibration-assisted scratch technique is presented in this study. SiCp/Al composites were processed by conventional scratch (CS) and ultrasonic vibration-assisted scratch (UVAS) respectively. The scratch profile under different processing parameters was explored. The results revealed that the scratch profile of UVAS is wider and deeper than that of CS, and the edge integrity is better. There are fewer cracks and pits at the bottom of ultrasonic scratches, the distance between the adjacent stick-slip lines is smaller, and the surface is smoother. The scratching speed (SS) influences the scratch profile, and the profile value gradually increases as the volume fraction (VF) of SiCp increases. Large ultrasonic amplitude (UA) can obviously increase the MRR.