Publication | Closed Access
Highly thermally conductive Ti3C2Tx/h-BN hybrid films via coulombic assembly for electromagnetic interference shielding
53
Citations
48
References
2022
Year
Materials EngineeringMaterials ScienceEngineeringHexagonal Boron NitrideApplied PhysicsElectromagnetic Interference ShieldingThermal ConductivityThermal ConductionCoulombic AssemblyElectrical Insulation
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