Investigating the physical, mechanical, and reliability study of high entropy alloy reinforced Sn–3.0Ag–0.5Cu solder using 1608 chip capacitor/ENIG joints - Concepedia

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Investigating the physical, mechanical, and reliability study of high entropy alloy reinforced Sn–3.0Ag–0.5Cu solder using 1608 chip capacitor/ENIG joints

10

Citations

45

References

2022

Year

Sri Harini Rajendran, Do Hyun Jung, Jae Pil Jung

Journal of Materials Science Materials in Electronics

Materials ScienceReliability StudyEngineeringChip Capacitor/enig JointsMechanical EngineeringHigh Entropy AlloyAlloy DesignElectronic PackagingMultiprincipal Element AlloyMicrostructure

References

	Year	Citations

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