Sri Harini Rajendran

Author

University of Seoul ORCID

Also Known As

Sri Harini Rajendran, Sri Harini Rajendran

Publications

330

Citations

H-Index

Concepts

All Affiliations

University of Seoul

About

Sri Harini Rajendran is an author at University of Seoul specializing in mechanical engineering, materials science, and engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	7	7	231
2	Materials Science	7	7	231
3	Applied Physics	3	3	174
4	Materials Engineering	3	3	152
5	Electrical Engineering	1	1	19

Sri Harini Rajendran

Publications

231

Citations

H-Index

Page 1

	Year	Citations
Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics Hyejun Kang, Sri Harini Rajendran, Jae Pil Jung Metals EngineeringMechanical EngineeringSn-based Lead-free SoldersElectronic PackagingMaterials Science	2021	102
Shear Strength and Aging Characteristics of Sn-3.0Ag-0.5Cu/Cu Solder Joint Reinforced with ZrO2 Nanoparticles Sri Harini Rajendran, Seung Jun Hwang, Jae Pil Jung Metals Materials ScienceMaterials EngineeringEngineeringMechanical PropertiesCorrosion	2020	36
Ultrasonic-Assisted Dispersion of ZnO Nanoparticles to Sn-Bi Solder: A Study on Microstructure, Spreading, and Mechanical Properties Sri Harini Rajendran, Hyejun Kang, Jae Pil Jung Journal of Materials Engineering and Performance Materials ScienceZno NanoparticlesEngineeringPower UltrasoundNanomaterials	2021	36
Transient Liquid Phase Bonding of Copper Using Sn Coated Cu MWCNT Composite Powders for Power Electronics Sri Harini Rajendran, Jung Do hyun, Jeon Wook Sang, Applied Sciences Materials ScienceSn-cu-mwcnt CompositesElectrical EngineeringEngineeringCarbon-based Material	2019	19
Active Brazing of Alumina and Copper with Multicomponent Ag-Cu-Sn-Zr-Ti Filler Sri Harini Rajendran, Seung Jun Hwang, Jae Pil Jung Metals Aluminium NitrideEngineeringMechanical EngineeringCorrosionFailure Analysis	2021	14
Comparative study on the wettability and thermal aging characteristics of SAC 305 nanocomposite solder fabricated by stir-casting and ultrasonic treatment Sri Harini Rajendran, Do Hoon Cho, Jae Pil Jung Materials Today Communications Materials ScienceSac 305EngineeringMaterial ProcessingMechanical Engineering	2022	14
Investigating the physical, mechanical, and reliability study of high entropy alloy reinforced Sn–3.0Ag–0.5Cu solder using 1608 chip capacitor/ENIG joints Sri Harini Rajendran, Do Hyun Jung, Jae Pil Jung Journal of Materials Science Materials in Electronics Materials ScienceReliability StudyEngineeringChip Capacitor/enig JointsMechanical Engineering	2022	10

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