Near-junction microfluidic cooling for GaN HEMT with capped diamond heat spreader

Review of Commercial GaN Power Devices and GaN-Based Converter Design Challenges

Edward A. Jones, Fred Wang, Daniel Costinett · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2016 · 1.1K citations

Electrical Engineering, Engineering, Power Device +11

Co-designing electronics with microfluidics for more sustainable cooling

Remco van Erp, Reza Soleimanzadeh, Luca Nela et al. · Nature · 2020 · 977 citations · Full text

Engineering, Liquid Metal Cooling, Sustainable Cooling +6

Emerging trends in wide band gap semiconductors (SiC and GaN) technology for power devices

Fabrizio Roccaforte, Patrick Fiorenza, Giuseppe Greco et al. · Microelectronic Engineering · 2017 · 543 citations

Semiconductors, Wide-bandgap Semiconductor, Electrical Engineering +10

Graphene quilts for thermal management of high-power GaN transistors

Zhong Yan, Guanxiong Liu, Javed M. Khan et al. · Nature Communications · 2012 · 535 citations · Full text

Water immersion cooling of high power density electronics

Patrick Birbarah, Tarek Gebrael, Thomas Foulkes et al. · International Journal of Heat and Mass Transfer · 2019 · 209 citations

Electrical Engineering, Engineering, Liquid Metal Cooling +7