Single crystal silicon wafer polishing by pretreating pad adsorbing SiO2 grains and abrasive-free slurries

Material removal mechanism in chemical mechanical polishing: theory and modeling

Jianfeng Luo, David Dornfeld · IEEE Transactions on Semiconductor Manufacturing · 2001 · 641 citations

Engineering, Materials Engineering, Materials Science +16

Nanomanufacturing of silicon surface with a single atomic layer precision via mechanochemical reactions

Lei Chen, Jialin Wen, Peng Zhang et al. · Nature Communications · 2018 · 215 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Humidity Dependence of Tribochemical Wear of Monocrystalline Silicon

Xiaodong Wang, Seong H. Kim, Cheng Chen et al. · ACS Applied Materials & Interfaces · 2015 · 98 citations

Engineering, Materials Engineering, Materials Science +15

Investigation on the final polishing slurry and technique of silicon substrate in ULSI

Yuling Liu, Kailiang Zhang, Fang Wang et al. · Microelectronic Engineering · 2003 · 88 citations

Engineering, Materials Engineering, Materials Science +14

Comparison of dicarboxylic acids as complexing agents for abrasive-free chemical mechanical planarization of copper

Suresh Ramakrishnan, S. V. S. B. Janjam, Udaya B. Patri et al. · Microelectronic Engineering · 2006 · 59 citations

Engineering, Materials Engineering, Materials Science +9