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A modulus-engineered multi-layer polymer film with mechanical robustness for the application to highly deformable substrate platform in stretchable electronics

Materials ScienceEngineeringFlexible ElectronicsMicrofabricationMechanical EngineeringPolymer ScienceApplied PhysicsDeformable Substrate PlatformPrinted ElectronicsStretchable ElectronicsElectronic PackagingFlexible SensorMechanical Robustness