Scientific Reports · 2021 · 39 citations · 33 references
EngineeringElectrical EngineeringInformation TechnologyInternet Of ThingsMicrofabricationSensorsIntegrated Circuit FabricationIot Data AcquisitionIot SensorsManufacturing TechnologyScreen PrintingDevice FabricationIot Application DeploymentIot Device Acquisition
The growing use of wireless and IoT devices in everyday life and industry creates a demand for rapid, efficient manufacturing methods. The study aims to demonstrate that roll‑to‑roll printing can fabricate IoT devices more quickly and cheaply than conventional methods. The authors fabricated a four‑layer flexible circuit platform—two conductive layers, an insulating layer with through holes, and a solder‑resist layer—using roll‑to‑roll screen printing, then printed solder paste to assemble sensors, processors, and Bluetooth modules into a fully roll‑to‑roll device. The successful deployment of the device demonstrates that roll‑to‑roll fabrication can be extended to other flexible, multilayer electronic applications.
Abstract With the development of technology, wireless and IoT devices are increasingly used from daily life to industry, placing demands on rapid and efficient manufacturing processes. This study demonstrates the fabrication of an IoT device using a roll-to-roll printing process, which could shorten the device fabrication time and reduce the cost of mass production. Here, the fabricated IoT device is designed to acquire data through the sensor, process the data, and communicate with end-user devices via Bluetooth communication. For fabrication, a four-layer circuit platform consisting of two conductive layers, an insulating layer including through holes, and a solder resist layer is directly printed using a roll-to-roll screen printing method. After the printing of the circuit platform, an additional layer of solder paste is printed to assemble the electrical components into the device, inspiring the fully roll-to-roll process for device fabrication. Successful IoT device deployment opens the chance to broaden the roll-to-roll fabrication process to other flexible and multilayer electronic applications.
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