First Results of Development of a Lifetime Model for Transfer Molded Discrete Power Devices

Abstract

The research on lifetime models of power module has already started in the late 1990s. However for the transfer molded discrete package, there is still a shortage of investigation on their power cycling capability regarding lifetime impacting parameters. In this work, first results of developing a lifetime model for transfer molded discrete power devices are shown. Through a study with original devices and locally opened devices of the same type, the impact of epoxy resin molding compound on power cycling capability was investigated.