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Thermal design and management of micro-pin fin heat sinks for energy-efficient three-dimensional stacked integrated circuits

3D Ic ArchitectureElectrical EngineeringChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)MicrofabricationThermal ManagementThermal DesignChip AttachmentIntegrated CircuitsElectronic PackagingHeat TransferMicroelectronicsThermal Engineering3D Integration