Characterization of through-silicon vias using laser terahertz emission microscopy - Concepedia

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Characterization of through-silicon vias using laser terahertz emission microscopy

29

Citations

31

References

2021

Year

Kristof J. P. Jacobs, Hironaru Murakami, F. Murakami, Kazunori Serita, Eric Beyne, Masayoshi Tonouchi

Nature Electronics

EngineeringOptical PropertiesApplied PhysicsTerahertz ScienceTerahertz TechniqueMicroelectronicsTerahertz PhotonicsOptoelectronicsThrough-silicon Vias

References

	Year	Citations

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