Innovative Smart Cut™ Piezo On Insulator (POI) Substrates for 5G acoustic filters

Abstract

5G standards implementation drive significant challenges at the acoustic filter level and requires innovative solutions. A promising approach relies in Surface Acoustic Waves technology combined with a thin LiTaO3 piezoelectric crystal layer bonded on Silicon substrate - so called POI-substrate, but suffers from volume manufacturing solution. We will report how Smart Cut™ layer transfer technology enables it.