Novel low‐dielectric constant and soluble polyimides from diamines containing fluorene and pyridine unit

Abstract

Abstract Polyimides (PI's) with low‐dielectric constant and excellent organic solubility have broad application prospects in the electronic field. Herein, this study designed a series of novel, low dielectric, organic soluble PI films by creatively introducing fluorene and pyridine ring into diamine monomers. Because of the noncoplanar structure of fluorenyl and the polarization of pyridine ring, PI films achieved a low‐dielectric constant (2.22–3.09 at 10 MHz) and excellent organic solubility. Even in some organic solvents with low‐boiling points, these PI films still exhibited outstanding solubility. In addition, all the films possessed high‐tensile strength (≈120 MPa) and excellent optical transparency (>70%, 450 nm). It was worth noting that the glass transition temperature of films was all above 280°C and 5% weight loss temperature ( T 5% ) was at 486–553°C. In general, the novel high‐performance low‐dielectric PI films are expected to be used in the field of microelectronics.