Deciphering the levelling mechanism of sorbitol for copper electrodeposition via electrochemical and computational chemistry study

Electrochemical methods: Fundamentals and applications

Surface Technology · 1983 · 4.7K citations

Natural Sciences, Chemical Engineering, Chemistry +12

Theoretical and experimental studies of multiple nucleation

B.R. Scharifker, Graham Hills · Electrochimica Acta · 1983 · 2.2K citations

Natural Sciences, Materials Science, Physics +11

Influence of surface morphology on corrosion and electronic behavior

Wei Li, Dongyang Li · Acta Materialia · 2005 · 405 citations

Natural Sciences, Materials Engineering, Materials Science +14

Superconformal Electrodeposition of Copper in 500–90 nm Features

Thomas P. Moffat, John E. Bonevich, William Huber et al. · Journal of The Electrochemical Society · 2000 · 403 citations

Natural Sciences, Materials Engineering, Materials Science +17

Leveling and Microstructural Effects of Additives for Copper Electrodeposition

James J. Kelly, Chunyan Tian, Alan C. West · Journal of The Electrochemical Society · 1999 · 242 citations

Natural Sciences, Materials Engineering, Materials Science +16