Publication | Open Access

Experimental characterization of rolled annealed copper film used in flexible printed circuit boards: Identification of the elastic-plastic and low-cycle fatigue behaviors

Materials ScienceEngineeringFlexible ElectronicsMechanical BehaviorCopper FilmMechanical EngineeringLow-cycle Fatigue BehaviorsPrinted ElectronicsSolid MechanicsMechanics Of MaterialsElectronic PackagingPlasticityExperimental CharacterizationLow-cycle Fatigue3D PrintingFlexible Sensor