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Thermal management of 3D chip with non-uniform hotspots by integrated gradient distribution annular-cavity micro-pin fins

3D Ic ArchitectureNon-uniform HotspotsChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)MicrofabricationThermal ManagementComputer Engineering3D IntegrationChip AttachmentThermal ModelingElectronic PackagingHeat TransferMicroelectronicsThermal Engineering3D PrintingMicrofluidics