Publication | Open Access
Large Elastic Deformation and Defect Tolerance of Hexagonal Boron Nitride Monolayers
43
Citations
40
References
2020
Year
NanosheetEngineeringDefect ToleranceBoropheneSemiconductorsBoron NitrideHexagonal Boron NitrideTensile TestingNanomechanicsLarge Uniform ElasticityMaterials SciencePhysicsCrystalline DefectsNanotechnologyLarge Elastic DeformationElectronic MaterialsApplied PhysicsCondensed Matter PhysicsMultilayer HeterostructuresThin Films
Monolayer hexagonal boron nitride can serve in optoelectronics or as a dielectric in graphene and other two-dimensional (2D) electronics due to its ultra-wide band gap. As there is no center of symmetry, monolayer hexagonal boron nitride (h-BN) also shows piezoelectricity. However, these applications require h-BN to sustain large uniform elastic deformation, which has yet to be demonstrated. Here, we report, by tensile testing, that a large elastic strain up to 6.2% is achieved for defect-scarce polycrystalline h-BN monolayers, with corresponding 2D Young’s modulus ∼200 N/m, close to the ideal value measured by atomic force microscopy (AFM). Furthermore, samples containing voids of ∼100 nm can be strained up to 5.8%. Atomistic and continuum simulations show that compared to the imperfections introduced during sample preparation, the elastic limit of h-BN is virtually immune to naturally occurring atomistic defects and is gradually lowered by submicrometer voids. The mechanical robustness of h-BN monolayers, along with the large uniform elasticity, is encouraging for strain engineering and piezoelectronics applications.
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