Journal of Materials Engineering and Performance · 2020 · 12 citations · 10 references
EngineeringMaterials EngineeringMaterials ScienceMechanical Behavior Of MaterialsSemiconductor MaterialsThin FilmsDamage MechanicsDielectricsFracture MechanicsFracture ToughnessSemiconductor DefectsSilicon MaterialsCrack FormationDielectric BreakdownDielectric StrengthSiliconThermal ShockThermal Shock FractureThermomechanical Stress
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Liquid-Like, Self-Healing Aluminum Oxide during Deformation at Room Temperature
Yang Yang, Akihiro Kushima, Wei‐Zhong Han et al. · Nano Letters · 2018 · 128 citations · Full text
Natural Sciences, Materials Engineering, Materials Science +17
Self-Replicating Cracks: A Collaborative Fracture Mode in Thin Films
Joël Marthelot, Benoît Roman, José Bico et al. · Physical Review Letters · 2014 · 93 citations · Full text