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Physically unclonable function in 28nm fdsoi technology achieving high reliability for aec-q 100 grade 1 and iso 26262 asil-b
39
Citations
4
References
2020
Year
Unknown Venue
EngineeringReal PufAec-q 100Hardware SystemsSecurity Key GenerationElectromagnetic CompatibilityHardware SecurityReliability EngineeringUnclonable FunctionElectronic EngineeringSystems EngineeringElectronic PackagingReliabilityElectrical EngineeringHardware ReliabilityComputer EngineeringDevice ReliabilityMicroelectronicsApplied PhysicsFault CoverageCircuit ReliabilityFault AttackPhysical Unclonable FunctionFdsoi Technology
Protection of information is of paramount importance in today's digital age. Physically Unclonable Functions (PUFs) are considered a secure method for security key generation because they generate responses that exist only during operation. A challenge regarding the use of PUFs is to achieve high reliability. Therefore, various schemes such as temporal majority voting [2], [3], [4], spatial majority voting [1], BCH [1], [3], and burn-in [3], are applied to improve the stability of the responses. While a recent paper proposed a method of oxide-break to achieve zero error [5], it is controversial if it is a real PUF since the response value (i.e. the status of the oxide-break) can be observed by reverse engineering. Automotive is an application area where reliability is particularly important, as failures may lead to critical accidents. To satisfy the reliability of AEC-Q100 Grade 1, functionality under -40-to-125°C in ambient temperature (Ta) must be guaranteed, even considering the aging effects on a chip. To satisfy IS026262 ASIL-B, the fault coverage must be over 90%. This paper shows a PUF satisfying both AEC-Q100 Grade 1 and IS026262 ASIL-B, where our testing temperatures cover -40-to-150°C in junction temperature (Tj) to compensate for the increased thermal heat within the SoC package.
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