Publication | Closed Access
Characterization and thermal modeling of a miniature silicon vapor chamber for die-level heat redistribution
55
Citations
46
References
2020
Year
Electrical EngineeringHeat Transfer ProcessEngineeringMicrofabricationHeat ExchangerApplied PhysicsThermal ManagementDie-level Heat RedistributionThermodynamicsThermal ModelingHeat TransferElectronic PackagingMicroelectronicsThermal EngineeringHeat PipeRefrigeration
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