IEICE Electronics Express · 2020 · 19 citations · 31 references
EngineeringComputer EngineeringComputer-aided DesignHeat TransferThermal AnalysisHeat Transfer ModelingIntegrated Circuit DesignLayout OptimizationThermal DesignThermal ManagementThermal SimulationCircuit SimulationGenetic Algorithm Based DesignGenetic Algorithm OptimizationPlacement AlgorithmsThermal Circuit ModelingThermal-aware DesignThermal-aware LayoutThree-dimensional Integrated Circuit Layout
In this letter, we propose a method for optimizing the thermal placement of heat and non-heat generating electronic components on a printed circuit board (PCB). Use a genetic algorithm to optimize the maximum temperature of the PCB and the total wire length between components. In the case that chips stacked in 3D ICs are reconfigurable, each chip construction of 3D ICs is also changed simultaneously. The temperature of each component is obtained by circuit simulation using a simple thermal circuit model. The experimental results demonstrate that the placement of components can be optimized well for lowering the maximum temperature with shorter wire lengths.
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A thermal-driven floorplanning algorithm for 3D ICs
Thermal-aware floorplanning using genetic algorithms
W. Hung, Yuan Xie, N. Vijaykrishnan et al. · 2005 · 117 citations