A novel thermal management scheme for 3D-IC chips with multi-cores and high power density

High-performance heat sinking for VLSI

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McPAT

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Hardware Security, Electrical Engineering, Hardware Modeling +13

Experimental and numerical study of pressure drop and heat transfer in a single-phase micro-channel heat sink

Weilin Qu, Issam Mudawar · International Journal of Heat and Mass Transfer · 2002 · 981 citations

Numerical Study, Heat Transfer Process, Engineering +9

Thermal Modeling, Analysis, and Management in VLSI Circuits: Principles and Methods

Massoud Pedram, Shahin Nazarian · Proceedings of the IEEE · 2006 · 506 citations

Engineering, Vlsi Design, Computer Architecture +19

A surrogate thermal modeling and parametric optimization of battery pack with air cooling for EVs

Wei Li, Mi Xiao, Xiongbin Peng et al. · Applied Thermal Engineering · 2018 · 187 citations

Electrical Engineering, Engineering, Energy Management +11