IEEE Microwave and Wireless Components Letters · 2019 · 28 citations · 10 references
EngineeringElectrical EngineeringAnalog ElectronicsMicroelectronicsMicrowave EngineeringCmos Circuit DesignHigh-frequency Semiconductor DevicesMicrowave AmplifiersMicrowave Integrated CircuitsMicrowave Semiconductor DevicesRadio-frequency Integrated CircuitsBoostingHigh-frequency Amplifier DesignHigh-gain AmplifiersMaximum GainMicrowave Amplifier DesignMillimeter-wave Integrated CircuitsPower ConsumptionRf Cmos Design
This letter presents a 51-73-GHz high-output power and efficiency frequency doubler, which is fabricated in a standard 65-nm CMOS process. The proposed frequency doubler adopts a fourth-order transformer-based balun and a dual-LC tank network to achieve wideband operating at input and output ports. In addition, a common-source amplifier with a Gm-boosting technique is used as an output buffer to improve the output power and efficiency. The measured results show that the doubler achieves input and output return losses below -10 dB from 26 to 36 GHz and 53 to 80 GHz, respectively. The measured maximum gain is 0.8 dB at 66 GHz with 22-GHz 3-dB gain bandwidth at an input power of 1 dBm. Furthermore, with an input power of 7 dBm, the proposed doubler also exhibits a high efficiency of 19.5% and an output power of 5.7 dBm at 66 GHz. The dc power consumption is 14 mW with 1-V power supply, and the chip size is 0.63×0.52 mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> including all test pads.
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Shita Guo, Tianzuo Xi, Ping Gui et al. · IEEE Transactions on Microwave Theory and Techniques · 2016 · 70 citations