Publication | Open Access

Topology optimization of heat sinks for instantaneous chip cooling using a transient pseudo-3D thermofluid model

EngineeringLiquid Metal CoolingComputer ArchitectureComputational MechanicsRefrigerationNumerical SimulationThermodynamicsThermal ModelingElectronic Packaging3D Ic ArchitectureElectrical EngineeringComputer EngineeringHeat TransferMicroelectronicsTopology OptimizationHeat ExchangerThermal ManagementHeat SinksThermal EngineeringInstantaneous Chip