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Tensile deformation and microstructures of Sn–3.0Ag–0.5Cu solder joints: Effect of annealing temperature

Materials ScienceMaterials EngineeringEngineeringTensile DeformationMechanical EngineeringAlloy DesignWeld Pool SolidificationSn–3.0ag–0.5cu Solder JointsMechanics Of MaterialsMicrostructure